New Solubility Test by Sliding on Ag-Pd-Cu-Au Alloys with Different Cu Contents into Different Solutions with or Without Mucin

نویسندگان

  • Seigo Okawa
  • Kenji Izumi
چکیده

Aims: The aims of this study was designed to analyze the released ions from Ag-Pd-Cu-Au alloys after a new sliding solubility test in different solutions with or without mucin. Materials and methods: Eluate solutions, similar to Fusayama’s artificial saliva, Hanks buffer solution, and artificial saliva with or without mucin were prepared. Ag-Pd-Cu-Au casting alloys were selected by particularly examining Cu of 0–20 wt%. The casting specimen surface was rubbed with zirconia balls in the eluate solutions using a seesaw movement for five minutes every hour for 7 days at 37°C. The amounts of ions were detected using inductively coupled plasma mass spectroscope (ICPMS). Data were analyzed using one-way repeated analysis of variance (ANOVA) and Tukey’s multiple comparisons (=0.05). Results: According to the addition of mucin to the solutions, amounts of elute Cu ions increased in higher Cu content alloys. Similarly, the elution of Zn ions was found to be increasing, with minor exceptions, among the alloys. As for the Pd ion elution, it was interesting that the amount of Pd ions decreased, with the exception for some eluate solutions. The dissolution of In ions can be expected to progress rapidly. The behavior of the released Ag ions was complex because it differed according to either the alloy or the elute solution, or both. Conclusions: For higher Cu content alloys, amounts of elute Cu ions increased in the elute solutions with mucin. In contrast, amounts of other metallic ions increased and decreased or showed no change depending on the test conditions. The differences of alloy components and elute solutions might be affected by the amounts of elute ions in this sliding solubility test. Not until the elute conditions were the same did the values for ion concentrations compare with conventional reported values.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Adhesion of adhesive resin to dental precious metal alloys. Part I. New precious metal alloys with base metals for resin bonding.

New dental precious metal alloys for resin bonding without alloy surface modification were developed by adding base metals (In, Zn, or Sn). Before this, binary alloys of Au, Ag, Cu, or Pd containing In, Zn, or Sn were studied for water durability and bonding strength with 4-META resin. The adhesion ability of the binary alloys was improved by adding In equivalent to 15% of Au content, Zn equiva...

متن کامل

Effects of Sn, Ga, and In additives on properties of Ag-Pd-Au-Cu alloy for ultra-low fusing ceramics.

Nine 35% Ag-30% Pd-20% Au-15% Cu alloys containing 2, 4 and 6 mass% of Sn, Ga or In as an additive metal were experimentally prepared to investigate the effects of different additives and their content on the physical and mechanical properties as well as the bond with a ultra-low fusing ceramic. Both the different additives and their content or either of these two factors significantly influenc...

متن کامل

Effects of Current Stressing on the Grain Structure and Mechanical Properties of Ag-Alloy Bonding Wires with Various Pd and Au Contents

Ag-alloy bonding wires containing various Pd and Au elements and traditional 4 N Au and Pd-coated 4 N Cu bonding wires were stressed with a current density of 1.23 ˆ 105 A/cm2 in air. The amounts of annealing twins in the Ag-alloy wires were much higher than those in Au and Pd-coated Cu wires. The percentages of twinned grains in these Ag-alloy wires increased obviously with current stressing. ...

متن کامل

Lead-Free Soldering – Where The World Is Going

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

متن کامل

Sulfuration resistance of five experimental Ag-Pd-Au-Cu alloys with low Pd content of 10 or 12%.

Commercial Ag-based alloy (46Ag-20Pd-12Au-20Cu alloy) is widely used in Japan as a casting alloy. As opposed to the commercial composition, we prepared five experimental Ag-based alloys with reduced Pd content of 10 or 12%, increased Au content of 20 to 30%, and reduced Cu content of 12 to 20%. We then evaluated their sulfuration resistance by analyzing cast specimen surfaces dipped in 0.1% Na2...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2016